JPS6424836U - - Google Patents

Info

Publication number
JPS6424836U
JPS6424836U JP12054087U JP12054087U JPS6424836U JP S6424836 U JPS6424836 U JP S6424836U JP 12054087 U JP12054087 U JP 12054087U JP 12054087 U JP12054087 U JP 12054087U JP S6424836 U JPS6424836 U JP S6424836U
Authority
JP
Japan
Prior art keywords
block
insertion hole
spacer block
spacer
heater
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12054087U
Other languages
English (en)
Japanese (ja)
Other versions
JPH08757Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987120540U priority Critical patent/JPH08757Y2/ja
Publication of JPS6424836U publication Critical patent/JPS6424836U/ja
Application granted granted Critical
Publication of JPH08757Y2 publication Critical patent/JPH08757Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1987120540U 1987-08-05 1987-08-05 半導体装置の樹脂封止装置 Expired - Lifetime JPH08757Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987120540U JPH08757Y2 (ja) 1987-08-05 1987-08-05 半導体装置の樹脂封止装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987120540U JPH08757Y2 (ja) 1987-08-05 1987-08-05 半導体装置の樹脂封止装置

Publications (2)

Publication Number Publication Date
JPS6424836U true JPS6424836U (en]) 1989-02-10
JPH08757Y2 JPH08757Y2 (ja) 1996-01-10

Family

ID=31366740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987120540U Expired - Lifetime JPH08757Y2 (ja) 1987-08-05 1987-08-05 半導体装置の樹脂封止装置

Country Status (1)

Country Link
JP (1) JPH08757Y2 (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008307738A (ja) * 2007-06-13 2008-12-25 Sumitomo Heavy Ind Ltd 圧縮成形金型及び圧縮成形金型装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6226827A (ja) * 1985-07-27 1987-02-04 Mitsubishi Electric Corp 半導体素子の樹脂封止方法及びその装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6226827A (ja) * 1985-07-27 1987-02-04 Mitsubishi Electric Corp 半導体素子の樹脂封止方法及びその装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008307738A (ja) * 2007-06-13 2008-12-25 Sumitomo Heavy Ind Ltd 圧縮成形金型及び圧縮成形金型装置

Also Published As

Publication number Publication date
JPH08757Y2 (ja) 1996-01-10

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